B7203-E-2RSD-T-P4S-UL Precision Bearing
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Brand |
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SEMRI |
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Manufacturer Part Number |
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B7203-E-2RSD-T-P4S-UL |
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Inside Diameter |
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17mm |
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Outside Diameter |
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40mm |
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Width |
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12m |
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Contact Angle |
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25° |
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Precision Grade |
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P4S |
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Seals or Shields |
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Laminated fabric cage |
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Clearance |
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CN = Standard Internal clearance |
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Cage Type |
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T = Outerring Guided Phenolic Cage
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Target Applications
1. Precision CNC Machine Tools & High-Speed Motorized Spindles
In light industrial and precision machining sectors, where cutting tools or workpieces are small in size, speeds of tens of thousands of RPMs are mandatory to achieve optimal cutting linear speeds:
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CNC Engraving-Milling & High-Gloss Machine Spindles: Engineered for rapid, micron-level precision milling of aluminum alloys, copper, graphite, acrylics, and high-density composites, ensuring mirror-like surface finishes.
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Dental Milling Spindles (Digital Dentistry): Specifically designed for micro-CNC cutting spindles processing zirconia, resins, and titanium alloy prosthetics. The 2RSD seals prevent airborne, highly abrasive ceramic dust from ingress into the bearing raceways.
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Woodworking & Aluminum Profile High-Speed Spindles: Serves as the core high-frequency spindle bearing in small-to-medium woodworking routers and aluminum frame/curtain-wall cutting machinery.
2. Electronics, Semiconductor & Automated Manufacturing Equipment
The electronics industry demands extreme responsiveness alongside prolonged maintenance-free and contamination-free lifecycles:
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High-Speed PCB (Printed Circuit Board) Routing & Drilling Machinery: Reliably supports the spindle at tens of thousands of RPMs while locking out epoxy resin dust and fiberglass fragments from entering the bearing.
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High-Speed Rotating Nozzles for Semiconductor Pick-and-Place Machines: Delivers extremely low rotational inertia and maximum dynamic responsiveness as the nozzle rapidly captures and rotates electronic components for alignment, easily coping with high-frequency start-stop cycles.
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Wafer Dicing Saws & Precision Slicing Equipment: Supports miniature cutting blades, ensuring the micro-level rotational axis remains perfectly centered with zero drift when slicing brittle semiconductor materials at ultra-high speeds.
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