HCB7011-C-T-P4S-UL Ceramic Precision Bearing
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Brand |
= |
SEMRI |
|
Manufacturer Part Number |
= |
HCB7011-C-T-P4S-UL |
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Inside Diameter |
= |
55mm |
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Outside Diameter |
= |
90mm |
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Width |
= |
18mm |
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Contact Angle |
= |
15° |
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Precision Grade |
= |
P4S |
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Seals or Shields |
= |
None |
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Material |
= |
Hybrid Ceramic |
|
Clearance |
= |
CN = Standard Internal clearance |
|
Cage Type |
= |
T = Outerring Guided Phenolic Cage |
Part Number Breakdown
Understanding the suffix codes explains exactly why it fits specific high-performance applications:
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HCB: Hybrid Ceramic Balls . Ceramic balls are 60% lighter than steel, significantly reducing centrifugal force and friction heat at extreme speeds.
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7011: Dimension series. 55mm bore(inner diameter), 90mm outer diameter, 18mm width.
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C: 15° contact angle. Designed for high radial stiffnessand stability, making it ideal for high-speed radial loads.
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T: Textile laminated phenolic resin ring-guided cage. Lightweight, low friction, and highly stable at high velocities.
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P4S: Boundary dimensions meet ISO Class 4 (ABEC-7), but running accuracy meets ISO Class 2 (ABEC-9). This guarantees minimal radial and axial runout (extremely high precision).
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UL: Universal matching for a single bearing with Light preload. It can be mounted in any combination (DB, DF, DT) based on spindle rigidity requirements.
Core Applications
Given its 55mm bore and its extreme speed capability (up to 34,000 RPM under oil-air lubrication), this bearing is heavily utilized in the following sectors:
1. Machine Tool Spindles
This is the most common application. It acts as the core rotational support in:
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High-Speed CNC Milling Machines & Machining Centers: Provides rigid and precise radial/axial support during high-speed cutting
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CNC Engraving and Routing Machines: Perfect for mold-making where high RPMs and minimal vibration are required to prevent tool marks.
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Precision Grinding Spindles: Internal grinding heads require absolute rotational accuracy to achieve flawless workpiece surface finishes.
2. Semiconductor & Optical Manufacturing Equipment
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Silicon Wafer Dicing Saws: Precision dicing requires sub-micron spindle runout. The HCB7011 maintains extreme rigidity and low thermal expansion at high speeds.
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Optical Lens Grinding / Fly-cutting Spindles: Ensures flawless surface reflectivity and precise geometries on optical components.
3. Vacuum Systems & High-Speed Testing
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Turbo-molecular Vacuum Pumps: Used in semiconductor processing environments. Ceramic balls prevent cold welding (seizure) in high-vacuum conditions and provide electrical insulation.
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Dynamic Balancing Machines: Supports high-speed rotors during balance testing with minimal friction interference.
4. Advanced High-Speed Turbomachinery
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Micro Gas Turbines & Turbochargers: Used in experimental or niche high-speed turbo systems where low heat generation and high rotational speeds are paramount.
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