HCB71906-C-T-P4S-UL Precision Bearing
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Brand |
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SEMEI |
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Manufacturer Part Number |
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HCB71906-C-T-P4S-UL |
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Inside Diameter |
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30mm |
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Outside Diameter |
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47mm |
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Width |
= |
9mm |
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Contact Angle |
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15° |
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Precision Grade |
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P4S |
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Seals or Shields |
= |
None |
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Material |
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Hybrid Ceramic |
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Clearance |
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CN = Standard Internal clearance |
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Cage Type |
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T = Outerring Guided Phenolic Cage |
Technical Nomenclature (Suffix Explanation)
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HCB: Hybrid Ceramic Ball Bearing. Features silicon nitride ceramic balls and high-performance steel rings. Ceramic rolling elements drastically minimize centrifugal force, lower operating temperature, and prevent adhesive wear.
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71906: Ultra-lightweight, thin-walled angular contact series with a 30 mmbore diameter (\(06 \times 5 = 30\text{ mm}\)).
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C: \(15^{\circ }\) Contact Angle. This specific geometry shifts the performance profile strictly toward extreme speedsand high radial stiffness.
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T: Outer-ring-guided laminated fabric cage(Phenolic resin/Bakelite). This lightweight, precision-machined cage is the industry standard for high-frequency spindle motors.
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P4S: FAG Super Precision Standard. Boundary dimensional tolerances meet ISO Class 4 (ABEC-7), while running accuracies meet the stricter ISO Class 2 (ABEC-9) standard.
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UL: Universal Matching for Light Preload. Units are factory-ground to be mounted interchangeably in any configuration (Back-to-Back DB, Face-to-Face DF, or Tandem DT), automatically providing a light preload.
Performance & Mechanical Data
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Basic Dynamic Load Rating (\(C_{r}\)): 8,500 N
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Basic Static Load Rating (\(C_{0r}\)): 4,200 N
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Limiting Speed (Grease Lubrication): 43,000 rpm
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Limiting Speed (Oil-Air Lubrication): 67,000 rpm
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Fatigue Limit Load (\(C_{ur}\)): 425 N
Core Industry Applications
Due to its \(15^{\circ }\) contact angle and high-speed ceramic architecture, this bearing excels in:
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CNC High-Speed Engraving & Milling Spindles: Ideal for rapid material removal on graphite, copper, aluminum, and high-density composites.
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PCB Drilling Machinery: Supports high-frequency spindle motors that run continuously at tens of thousands of RPMs to produce micro-vias on circuit boards.
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Precision Internal Grinding Heads: Delivers exceptional rotational accuracy (micron-level runout) to eliminate chatter marks when grinding tight bores.
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Semiconductor Processing Equipment: Used in wafer slicing saws and precision rotary tables that demand thermal stability and high speeds.
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